You discovered your kid is cutting, leaving you with a sinking feeling in your stomach. You ask yourself questions such as: Is my kid's self-harm my fault? Did I fail as a parent? Where is the smiling kid I once knew? Cutting is the behavior that tells you something is definitely wrong and that your kid needs immediate understanding and help. Dr. J.J. Kelly has been working with teens and young adults for the last fifteen years, and she is the person whom other professionals send their self-harm patients to. In Holy Sh*t, My Kid Is Cutting , she makes sure you: Uncover why your kid is cutting by debunking myths and revealing truths about self-harm Build your plan of action to make the cutting stop Find the professional who actually helps Move your kid forward to becoming a healthy, active, joyful young adult Relieve your worry and guilt, and get all the tools you need to steer your kid onto a healthy, happy path again.

Need some ideas about what to improve? PDCA/PDSA, TQM, Reengineering, ISO9000, CMM, CMMI, Six Sigma, Lean, Lean Six Sigma, JIT, DoE, statistical process control, EFQM, Kaizen, 5S... All of these methods and frameworks are great and provide you with the HOW. But then they leave you to figure out the WHAT by yourself. This book fills the gap on WHAT to look at improving. I give you hundreds of simple improvements that can be implemented across your team and company regularly, quickly and cheaply. We follow the spirit of Kaizen by achieving small steps that over time add up to huge savings, productivity gains and business growth. Simply open the book anywhere and choose an improvement. The improvements can by implemented by everyone across the company. At the end of the book I have a special freebie for readers - new improvement opportunities every week via email. We can all use some prompting to keep our businesses fresh and continually improving.

The film stress of Ni films deposited at near-ambient temperatures from sulfamate electrolytes was studied. The particulate filtering of the electrolyte, a routine industrial practice, becomes an important deposition parameter at lower bath temperatures. At 28 C, elevated tensile film stress develops at low current densities (